Optimized circuit configurations and high-speed memory systems tailored to the rigid quality and thermal metrics of European precision engineering.
Switzerland has long stood at the peak of global high-precision technology, leading in sectors such as industrial robotics, medical instrumentation, high-performance computing, and railway engineering. Under the framework of Industrie 4.0, Swiss mechanical and electrical engineering companies (represented heavily in regions like Zurich, Aargau, Basel, and Geneva) require circuit board components that deliver exceptional durability, narrow tolerances, and superior heat management.
In this ecosystem, Aluminum PCBs (Metal Clad PCBs / MCPCBs) play a critical role. Traditional FR-4 substrate materials fail to dissipate heat efficiently in high-power setups, causing premature component failure. Aluminum core PCBs utilize a high-performance dielectrically bonded thermal interface layer to transfer heat away from critical power semiconductors up to ten times faster than standard glass-reinforced epoxies. From high-lumen Alpine tunnel lighting systems to solar grid inverters in Graubünden, our Swiss clients count on our engineered aluminum substrates to guarantee zero-fail operation under extreme temperature variances.
A deep breakdown of the stackup layers and mechanical properties driving high-thermal performance in metal clad PCB design.
| Parameter / Feature | Standard Specification | Premium / High-Reliability Option | Swiss Regulatory Alignment |
|---|---|---|---|
| Base Plate Alloy | Aluminum 1060 (Pure Al) | Aluminum 5052 / 6061 (High Tensile) | EN AW-5052 / AW-6061 Compliant |
| Thermal Conductivity | 1.0 - 2.0 W/m·K | 3.0 - 8.0 W/m·K (Nano-Ceramic) | CE & UL 94 V-0 Flammability Rated |
| Dielectric Thickness | 75μm to 150μm (3 mil to 6 mil) | Ultra-thin 38μm (Low thermal resistance) | High Dielectric Breakdown >4kV - 6kV AC |
| Base Copper Thickness | 35μm (1 oz) | 70μm - 105μm (2 oz - 3 oz Heavy Copper) | IPC-6012 Class 3 Performance |
| Surface Finish | HASL (Lead-Free) | ENIG (Immersion Gold) / OSP | RoHS (Restriction of Hazardous Substances) |
| Solder Mask Options | High-Reflective White, Black | Super-white (Lumen retention >98%) | UV Aging Resistant, Low Outgassing |
Our manufacturing technology routes are strictly audited under IATF 16949 (for automotive electronics) and ISO 9001:2015 quality guidelines. By employing automated precision routing, laser profiling, and multi-stage vacuum pressing, we eliminate microscopic delamination risks between the aluminum core and the dielectric prepreg. This structural integrity ensures the boards withstand high thermal cycling tests (-40°C to +125°C) common in Swiss outdoor industrial deployments.
In a volatile geopolitical landscape, procurement managers across Geneva, Zurich, and St. Gallen prioritize supply chain predictability. Partnering directly with a consolidated manufacturer like Corexis Memory Technology Co., Ltd. offers distinct structural advantages over multi-tier broker distribution models.
100% full inspection policy using Automated Optical Inspection (AOI), X-Ray layer analysis, and thermal stress test rigs prior to export dispatch.
Go from quick-turn prototype validation (in as fast as 48 hours) directly to high-volume assembly lines within our integrated 21,800 m² factory footprint.
From customized trace layouts, copper weights, and thermal core profiles to custom branding, heat spreader designs, and bespoke packaging solutions.
Direct air freight channels to Zurich (ZRH) and Geneva (GVA) airports. Seamless Swiss customs clearing through accredited logistics partners.
Established in 2016, Corexis integrates high-precision R&D, advanced SMT assembly lines, and global electronics distribution under one roof.
As a leading hardware developer, Corexis bridges the gap between memory processing excellence and heat management substrates. By offering high-speed DDR4/DDR5 system memory alongside highly conductive PCB substrates, we supply comprehensive, reliable hardware blocks for computer systems, server hosting centers, and high-frequency industrial welding networks worldwide.
A visual tour inside our modern production floor, featuring multi-million dollar SMT placement systems, clean room environments, and precise testing chambers.
Custom logic controllers and heavy-duty heat sink cooling components designed to operate under strict technical constraints.
High-speed DDR4 memory configurations engineered for high uptime, virtualization, and workstation stability.
Get direct answers from our engineering division on compliance, thermal capabilities, design processes, and export logistics.
We offer standard substrates with thermal ratings of 1.0 - 2.0 W/m·K for normal lighting, intermediate levels of 3.0 W/m·K for automotive regulators, and specialized nano-ceramic dielectrics reaching up to 8.0 W/m·K for heavy solar power control panels and EV fast-charging units.
Yes. Every single shipment destined for Switzerland complies with EU directives, RoHS regulations, REACH requirements, and CE guidelines. We also guarantee lead-free solder masks and plating options, ensuring seamless import customs handling in compliance with Swiss national laws.
Absolutely. As a direct OEM/ODM manufacturer, we provide custom PCB color options (green, blue, red, matte black, matte white), custom silk-screen branding, individualized retail boxing, customized heat spreader configurations, and specific capacity adjustments for our memory modules.
Our quality assurance team (consisting of 56 inspectors) runs standard testing protocols: Incoming Material Inspection (IQC), In-Process QC (IPQC), thermal shock testing (cyclic temperature stress tests), High-Voltage Insulation Breakdown tests, Flying Probe electrical tests, and final Outgoing Quality Assurance (OQA) inspections.
Fast-track PCB prototyping takes between 2 to 5 working days depending on thickness and stack complexity. Batch manufacturing is completed within 7 to 15 working days. Shipping via premium air express couriers (DHL, FedEx, UPS) directly to Zurich or Geneva addresses typically takes 3 to 5 business days.
Submit your Gerber layout files, material guidelines, or memory module specifications. Our Swiss engineering team will review the layout parameters and respond with DFM analysis within 24 hours.
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Corexis Memory