Corexis Memory
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| Items | Capacity |
| 1. Material | FR4, (High Tg, General Tg, Middle Tg), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc. |
| 2. Board thickness | Mass production: 10mm; Samples: 17.5mm |
| 3. Surface finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| 4. PCB Max size | 1150mm × 560mm |
| 5. Layer | Mass production: 2~58 layers; Pilot run: 64 layers; Flexible PCB: 1-12 Layers |
| 6. Min hole size | Mechanical drill: 0.2mm; Laser drill: 0.075mm |
| 7. PCBA QC | X-ray, AOI Test, Functional Test |
| 8. Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Back drilling, and Resistance control. |
| 9. SMT Capacity | 700 Million Points/Day |
| 10. DIP Capacity | 0.5 Million Points/Day |
Our team provides the following services to our clients: Schematic Design & Board Layout, PCB & FPC Manufacturing, Metal Injection Molding, Global Supply Chain Management, PCB & PCB Assembly Service. We deliver finished goods to you with the flexibility to match your specific needs and requirements.
We provide one-stop PCBA services, such as 0201/BGA/CCGA surface-mount (SMT), thru-hole (THT), mixed technology, conformal coating, potting and encapsulations, AOI/X-Ray PCBA testing, IC programming, and box building service. Our products are used in telecommunications, automotive electronics, 5G products, IoT, AI smart control, RF, networking, security, industrial control, and medical instrumentation.
