Explore our core engineering capabilities, customized memory solutions, and prototype development platforms engineered for industrial scalability.
Powered by precision engineering, advanced manufacturing capacity, and global delivery compliance.
As electronic systems shift toward higher power density and miniaturization, the requirements for interconnect components have surged. The double-sided printed circuit board (DS-PCB) serves as the fundamental backbone for mid-to-high complexity circuits. By providing routing layers on both sides linked by precision-drilled plated-through holes (PTH), these boards offer optimized layout density without the compounding costs of high-layer multilayers.
Modern applications dictate high thermal tolerance and signal integrity. As speed transitions from legacy structures to high-performance layouts like DDR5, system design demands low dielectric constant (Dk) materials, controlled impedance traces, and enhanced thermal dissipation structures. Double-sided boards utilizing substrates like High-Tg FR-4, Aluminum, and specialized materials like Taconic TLY-5 (0.254mm) are replacing standard composites in harsh operations. Key design trends include:
International procurements are moving away from merely low-cost sourcing toward robust supply chain resilience, high QA standard compliance, and rapid prototyping capabilities. Procurement officers prioritise vendors who can bridge custom PCB engineering and assembly with high-speed surface-mount technology (SMT). A seamless single-source partner reduces lead times, cuts validation costs, and minimizes communication overhead between PCB fab houses and assembly contractors.
Operating from a 21,800 m² modern facility, Corexis integrates manufacturing and SMT processes to implement Factory 4.0 paradigms. With state-of-the-art automated optical inspection (AOI), X-ray validation, and advanced testing setups, we maintain strict quality control. Supply chain vertical integration allows us to keep a stable supply of raw laminates, copper clads, and premium memory ICs, ensuring constant output even amidst volatile global market conditions.
From custom product engineering to advanced high-speed assembly, we deliver performance-tested electronics components.
Supported by 128 dedicated R&D engineers, we execute hardware design, firmware optimization, and custom impedance-controlled PCB layout configurations.
Our QA workflow features 56 professional QC specialists supervising IQC, IPQC, FQC, OQA, and strict environmental testing chambers.
8+ years of dedicated export experience catering to North America, Europe, Southeast Asia, South America, and Middle East industrial standard frameworks.
Detailed capabilities sheet representing Corexis Memory Technology Co., Ltd. industry operations.
Take a look inside our SMT production lines, high-precision assembly stations, and inspection facilities.
Answers to crucial manufacturing, customization, and logistical concerns of global procurement leads.
Depending on copper weight, we support trace widths and spacing down to 0.1mm (4 mil) for standard FR-4 substrates, guaranteeing high circuit density and reliability in small enclosures.
Yes, we offer custom PCB layout design specifically optimized for high-speed DDR4 and DDR5 memory modules, ensuring proper signal routing, impedance matching, and thermal distribution.
We execute multi-tier validation, including Incoming Material Inspection (IQC), In-Process Quality Control (IPQC), final functional tests (FQC), and Outgoing Quality Assurance (OQA) using modern testing fixtures and functional software diagnostics.
We support various laminate solutions, including standard FR-4, high-TG material for high-temperature environments, Aluminum substrate for heat dissipation, and high-frequency materials like Taconic TLY-5 (0.254mm) for microwave applications.
Prototype circuit boards and assembly can be processed in 3 to 7 working days, while bulk mass production batches typically take 15 to 25 days depending on component sourcing and layout complexity.
Yes, Corexis offers complete turnkey Electronic Manufacturing Services (EMS), including SMT assembly, DIP plug-in soldering, components sourcing, functional firmware loading, and custom casing packaging.
Absolutely. We offer complete OEM/ODM options, including custom silk-screening, custom heatsink engraving, private label product validation, and custom packaging layouts matching global brand standards.
We support ENIG (Electroless Nickel Immersion Gold), HASL (Hot Air Solder Leveling), Lead-Free HASL, OSP, Immersion Silver, and Immersion Tin depending on assembly requirements and application wear.
Discover our range of memory chips, high-frequency circuits, custom SMT assemblies, and industrial automation control boards.
Corexis Memory