Corexis Memory Technology Co., Ltd. stands as a beacon of innovation in the Chinese semiconductor and active components landscape. Established in 2016, we have evolved from a specialized DRAM manufacturer into a diversified powerhouse providing active components, multi-layer PCBs, and advanced PCBA assembly services. Our mission is to bridge the gap between high-end technological demands and cost-effective manufacturing without compromising on the E-E-A-T principles that global system integrators and OEMs demand.
With a sprawling 21,800 m² facility and a team of 128 R&D engineers, Corexis integrates the entire lifecycle of electronic component production. From initial circuit design using high-frequency Taconic substrates to the final stress testing of 3200MHz DDR4 modules, every step is governed by a rigorous "100% Full Inspection" policy. Our annual export revenue of USD 26.8 Million reflects our status as a trusted partner in North America, Europe, and the Middle East.
As the world transitions to 5G and Edge Computing, the demand for high-reliability active components has surged. We provide the backbone for data centers with our ECC-registered server memory and high-layer count PCBs that support high-speed data transmission with minimal signal loss.
Our PCBA solutions for industrial automation utilize immersion silver finishes and IGBT driver boards (like the ZX7 series) to ensure longevity in harsh environments. These components are critical for the robotics and smart manufacturing sectors that require zero-downtime performance.
From high-speed hair dryer control boards to automotive infotainment memory, Corexis offers specialized customization. We understand the stringent safety and thermal requirements of the modern consumer electronics market, delivering components that exceed standard lifespan expectations.
In the complex world of semiconductor procurement, compliance is non-negotiable. Corexis adheres to international standards including RoHS, CE, and FCC. Our localization strategy involves deep integration with regional distributors to provide "Just-in-Time" delivery and technical on-site support.
The semiconductor industry is on the cusp of a "Smart Connectivity" era. Corexis is not just following trends; we are setting them. Our R&D focus for 2024-2026 includes:
Expansion of DDR5 production lines to meet AI server demands, focusing on 4800MHz and 5600MHz frequencies with On-die ECC.
Integration of GaN (Gallium Nitride) technology into our PCBA designs to improve power efficiency in consumer electronics by 30%.
Pioneering High-Density Interconnect (HDI) PCBs for the next generation of wearable AI devices and 6G infrastructure.
Corexis Memory
