Corexis Memory
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| Items | Capacity |
| Material | FR4, (High Tg, General Tg, Middle Tg), Halogen Free FR4, Ceramic, Teflon, PI, BT, PPO, PPE etc. |
| Board thickness | Mass production: 10mm; Samples: 17.5mm |
| Surface finish | HASL, Immersion Gold/Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| PCB Max panel size | 1150mm × 560mm |
| Layer Count | Mass production: 2~58 layers; Pilot run: 64 layers; Flexible PCB: 1-12 Layers |
| Min hole size | Mechanical drill: 8mil(0.2mm); Laser drill: 3mil(0.075mm) |
| PCBA QC | X-ray, AOI Test, Functional Test |
| Special Process | Buried Hole, Blind Hole, Embedded Resistance/Capacity, Hybrid, Back drilling. |
| SMT/DIP Capacity | SMT: 700M Points/Day; DIP: 0.5M Points/Day |
Comprehensive Electronics Services: We provide Schematic Design & Board Layout, PCB & FPC Manufacturing, Metal Injection Molding, and Global Supply Chain Management. Our services deliver finished goods directly to you or via drop shipping. We maintain the flexibility to match your specific technical needs.
One-Stop PCBA Solutions: Specialized in 0201/BGA/CCGA surface-mount (SMT), thru-hole (THT), mixed technology, conformal coating, potting, and encapsulations. Testing includes AOI, X-Ray, and full functional testing. Applications cover telecommunications, automotive, 5G, IOT, AI smart control, industrial, and medical fields.
